Education:Doctor
Release date:
Salary:120K以上
Work experience :10-20 years
City:Foshan, Guangdong Province
Categories: Equipment Design and Manufacturing, Industrial Machinery Manufacturing
First-level areas:Equipment Design and Manufacturing
First-level areas:Industrial Machinery Manufacturing
Source:Social Recruitment
Job description :
Job Responsibilities.
As a technical backbone, participate in the planning of power electronics development strategies and the formulation of technical routes. Through breakthroughs in core technologies such as high-power density module packaging, Midea’s competitiveness in the field of power electronics power conversion is enhanced;
2. Lead/participate in the preliminary research and technological productization work of the power electronics technology platform, combine packaging technology with high power density converters, apply them to the forefront areas of the group’s strategy such as energy storage and robotics, and communicate with relevant business units to meet their needs, jointly initiate projects, and effectively execute them;
3. Based on customer needs, lead the design, construction, and debugging of the power electronics hardware platform;
4. Explore the cutting-edge technologies of integrated packaging and high power density converters in the field of power electronics, and vigorously promote the industrialization of new technologies.
Qualifications for the position.
1. Doctoral degree, major in Power Electronics/Electrical Engineering/Industrial Automation or related fields;
2. More than 15 years of research and development work experience (doctoral degree with more than 8 years of work experience);
3. Possess a sense of teamwork, good communication and coordination skills;
4. Proficient in the research and development process and process requirements of power electronic power modules or power supply modules, with rich experience in packaging testing, analysis, design, and debugging;
5. Familiar with various topologies of AC/DC, DC/DC, and DC/AC converters;
6. Familiar with the principles and related application technologies of power electronic devices;
7. Proficient in commonly used software for packaging design, such as Pspice, Ansys, Solidworks, FLUENT, etc.
Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.