Education:Doctor
Release date:24-11-28 15.45.36
Salary:50-80K
Work experience :Unlimited experience
City:Jiangsu Province
Categories: Chips, Electronic Components and Equipment, Information Technology
First-level areas:Information Technology
First-level areas:Chips, Electronic Components and Equipment
Source:Social Recruitment
Job description :
Job Responsibilities.
1. Assist in setting annual research and development goals, including forward-looking technology direction research and development strategies and technology roadmaps;
2. Responsible for vertical project application in relevant technical directions and undertaking research tasks to ensure timely completion of R&D plans;
3. Actively engage in industry cooperation and undertake horizontal research and development projects;
4. Responsible for building the R&D team and daily management work;
5. Responsible for leading the R&D team to publish high-level academic papers and apply for relevant patents.
Qualifications for the position.
1. PhD student, majoring in microelectronics, materials, semiconductor physics, and related fields;
2. At least 3 years of advanced packaging project management experience, team management experience is preferred;
3. Proficient in advanced packaging integration technologies such as 2.5D/3D integration and COWOS, familiar with advanced packaging related processes and equipment;
4. Be able to systematically summarize research and development results and form scientific research reports or scientific papers;
5. Has excellent communication and management skills.
Salary negotiable
Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.