First-level areas：Information Technology
First-level areas：Chips, Electronic Components and Equipment
Source：Social Recruitment
Job description ：
Job Responsibilities.
1. Responsible for the research and development of hybrid bonding technology for heterogeneous integration of high-end digital chips;
2. Responsible for researching the bonding mechanisms of various inorganic interface bonding materials in hybrid bonding technology, such as SiO2, SiCN, SiON, etc;
3. Responsible for the characterization of interface physical and chemical states and analysis of evolution processes related to hybrid bonding technology.
Qualifications for the position.
1. PhD student, majoring in microelectronics, semiconductor materials, semiconductor physical chemistry, and related fields;
2. Familiar with hybrid bonding technology; Familiar with material interface characteristics and various characterization methods; Having a background in semiconductor physics and knowledge of 3D integration technology; Understand advanced packaging related materials and process equipment;
3. Published papers in core journals and filed patent applications.

Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.