First-level areas：Information Technology
First-level areas：Chips, Electronic Components and Equipment
Source：Social Recruitment
Job description ：
Job content.
1. Advanced packaging technology development. Conduct research and validation of new products and processes based on the company’s development;
2. Advanced packaging process technology and project development. Lead the development of new projects, complete project content according to project requirements, solve related process problems, and coordinate multi departmental collaboration;
3. Characterize materials and devices, analyze data to form reports, write process related technical documents, and achieve sustainable development of process technology;
4. Lead the technical team to solve product problems and develop new industry standards;
Job requirements.
1. Doctoral degree, majoring in microelectronics, integrated circuits, optoelectronics, materials science, chemistry, physics and other engineering disciplines;
2. Candidates with semiconductor packaging and testing related work experience are preferred (excellent recent doctoral students are also welcome);
3. Have a solid theoretical foundation and professional knowledge, strong scientific research ability and professional dedication;
4. Candidates with experience in leading major national projects are preferred;
5. Possess good logical thinking, communication skills, innovation ability, and teamwork spirit, with a strong interest in research and development work;

Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.