First-level areas：Information Technology
First-level areas：Chips, Electronic Components and Equipment
Source：Campus Recruiting
Job description ：
Job Responsibilities:
Design CMOS backplane chips, design digital driver chips, communicate and collaborate with the Layout team, work with Foundry technicians, write technical documents, and collaborate with testers. Collaborate with the packaging team.
Qualifications for the position.
1. Master’s degree or above, major in microelectronics, electronics, chip related fields;
2. Experience in CMOS chip design and successful chip fabrication is preferred;
3. Those who understand semiconductor process technology and have experience in communication and cooperation with Foundry are preferred;
4. Having good logical thinking, learning ability, problem-solving ability, communication and teamwork skills;
5. Positive, optimistic, responsible, achievement oriented, and strong ability to withstand pressure;
6. English proficiency level 4 or above is preferred as a working language.

Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.