First-level areas：Information Technology
First-level areas：Chips, Electronic Components and Equipment
Source：Social Recruitment
Job description ：
Job description.
1. Advanced packaging technology development. Conduct new product and process research and development based on the company’s development;
2. Advanced packaging process technology and project development. Lead the development of new projects, complete project content according to project requirements, and solve related process problems;
3. Characterize materials and devices, analyze data to form reports, write process related technical documents, and achieve sustainable development of process technology;
4. Lead the technical team to solve product problems and develop new industry standards.
Job requirements.
1. Doctoral degree with experience in semiconductor packaging and testing is preferred (excellent recent doctoral students are also acceptable), with majors in condensed matter physics, physical electronics, microelectronics, and solid-state electronics;
2. Having a solid theoretical foundation and professional knowledge, strong scientific research ability and professional dedication;
3. Experience in leading major national projects is preferred;
4. Has good logical thinking, communication skills, innovation ability, and teamwork spirit, and has a strong interest in research and development work.

Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.