First-level areas：Information Technology
First-level areas：Chips, Electronic Components and Equipment
Source：Social Recruitment
Job description ：
[Job Responsibilities]
Responsible for the research and development of advanced packaging technology, with a focus on.
1. Key processes of wafer level system integration technology (SoW) for high computing power;
2. Wafer level system integration technology based on 2.5D/FO and other technical solutions;
3. Hybrid bonding and heterogeneous bonding techniques;
4. 3D stacking and micro bump welding technology;
5. Hybrid bonding technology for heterogeneous integration of high-end digital chips;
6. Heterogeneous integration technology.
【 Qualifications 】
1. PhD student, majoring in microelectronics, semiconductor materials, semiconductor physical chemistry, and related fields;
2. Understand advanced wafer level packaging technology and prioritize research topics related to the aforementioned research and development directions;
3. Has strong problem-solving skills, good communication skills, and excellent teamwork spirit.

Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.