First-level areas：Materials, new materials
First-level areas：Non-ferrous metal materials, iron and steel materials
Source：Social Recruitment
Job description ：
The specific job information is as follows.
1. Responsible for mobile phones PC、 Standardization of materials for heat sinks/heat sinks of servers and other chips, establishment of standardized frameworks and management rules;
2. Participate in the development, design, product evaluation, production process analysis, and targeted process optimization of heat sink/heat spreader products through heat dissipation simulation methods;
3. Technical approval, research, verification, and application promotion of related heat dissipation material research projects;
4. Application testing and promotion of new heat dissipation materials;
5. Coordinate with customer chip packaging engineering and heat dissipation engineering teams
Job requirements.
1. Doctoral degree, major in Metal Materials Science, Materials Science and Engineering, or related fields.
2. More than three years of experience in heat sink design;
3. Familiar with professional knowledge such as heat transfer force and simulation software such as Flotherm;
4. Candidates with relevant research experience in thermal pads, thermal pastes, thermal coatings, as well as VC heat dissipation, heat pipe heat dissipation, and radiator materials are preferred.
5. Have good communication and writing skills in both Chinese and English.

Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.